Digital Surf has just released a new update of Mountains® software version 11.2. Let’s take a closer look at what’s included in this update.
Control substrate warpage in semiconductor packaging
- Measure substrate deformation caused by thermal and mechanical stress
- Visualize warpage in 3D / use 2D color maps to identify critical zones
- Detect deviations impacting contact reliability
- Support process optimization and early defect detection
Above: Visualization of warpage in 3D
Above: Color-coded warpage map & parameters including local warpage with interactive cursor
Ensure coplanarity of solder balls (BGA / bumps)
- Measure coplanarity of solder balls (or bumps) in BGA packages
- Automatically structure arrays with grid-based indexing for consistent analysis
- Detect defects: bridging, misalignment, non-conforming balls (size/shape deviations)
- Define pass / warning / fail criteria with clear visual maps
- Apply ISO / JEDEC-based parameters for standardized evaluation
- Enable statistical analysis and comparison across samples
Above: Top view of BGA grid with color-coded pass/fail map for heights and 3D view of out-of-tolerance defect (above).
Above: Coplanarity calculations including ISO/JEDEC-compliant geometrical and positioning parameters (left).
Learn more & update
For a full list of the changes and bug fixes published in this release, please download the release notes available here.
Access to this latest release is included in the Mountains® Software Maintenance Plan (SMP). Please visit our Software Updates page.
To find out more about SMP options, please contact sales@digitalsurf.com or visit this page.