MountainsMap® Example Applications

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Semiconductor wafer backgrinding – inspection & roughness

Low-force contact scanning profilometer + MountainsMap® Scanning Topography software

Input Data

  • Low-force stylus scan (x, y, z) on zone of wafer after backgrinding.
  • Results

  • 3D view of zone showing vacuum hole shadow defects.
  • Surface roughness parameters (elevated because of defects).
  • Analysis of defect morphology.
  • MountainsMap® tools used

  • 3D view.
  • ISO 25178 height parameters.
  • Grains & Particles module for analyzing the vacuum holes.

  • List of applications in gallery

    3D Optical

    3D Scanning



    SEM (scanning electron microscope)



    Correlative Studies

    3D Optical Profiler + SEM (scanning electron microscope)

    AFM-IR (atomic force microscope with tunable pulsed infrared source)

    STM (scanning tunneling microscope) + SEM (scanning electron microscope)

    AFM (atomic force microscope) + SEM (scanning electron microscope)

    AFM (atomic force microscope) + fluorescence microscope

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