MountainsMap® Example Applications
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Semiconductor wafer backgrinding – inspection & roughness
Low-force stylus scan (x, y, z) on zone of wafer after backgrinding.
3D view of zone showing vacuum hole shadow defects.
Surface roughness parameters (elevated because of defects).
Analysis of defect morphology.
Mountains® tools used
ISO 25178 height parameters.
Grains & Particles module for analyzing the vacuum holes.
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